Metallic Binders

M2-01 - Copper-tin alloy matrix.

MS-1 - Copper-tin alloy matrix reinforced with silicon carbide (metal matrix composite).

MB-1 - Copper-tin alloy reinforced with boron carbide (metal matrix composite).

MS-1A - Aluminum-copper alloy matrix reinforced with silicon carbide (not confirmed).

Resin Binders

B1-10 - Boron-modified phenolic resin (BPF) composite, made of powdered bakelite, copper additive

B2-01 - Boron-modified phenolic resin (BPF) composite, made of liquid bakelite, iron additive (softer than В1-10)

В2-01М - Boron-modified phenolic resin (BPF) composite, made of liquid bakelite, copper additive (softer than В2-01)

OSB (OCB) – A proprietary phenolic resin composite. (OSB and OCB refer to the same binder; the difference arises from a transliteration quirk of the Cyrillic “ОСБ,” which can be rendered as either “OSB” or “OCB” in Latin script.)